RF Solutions

Radio Frequency Interference

RFI Shielding

Advancing technology and the proliferation of electronic equipment has resulted in increased electro-magnetic pollution. World-wide standards have been set to control the effects. Measured levels of emissions and susceptibility to and from other apparatus are controlled using various techniques, circuitry and layout design, filters and ferrites, gauzes and conductive gaskets plus the construction material of the device housing.

Enclosure design is a fundamental part of the shielding effectiveness of the electronic equipment. Desired attributes of portability, aesthetic appeal, light weight, component location and cost have increased the use of plastics to form enclosures. The main disadvantage is achieving EMC Compliance as they are now inherently transparent to electro-magnetic and radio frequency interference. ‘Metallising’ the plastic substrate is an established method, which RF Solutions undertakes. Conductive colloids are metal loaded resin based materials that are spray applied. The metal is the reflective or absorbent barrier to the RFI and EMI and normally takes the form of layers of metal flakes or granules. The most popular materials being Nickel, Copper, Copper hybrid, Silver hybrid and Silver.